Learner Reviews & Feedback for Advanced Semiconductor Packaging by Arizona State University
About the Course
Top reviews
RK
Mar 28, 2024
Very well deliverd and extremely pleased with the contents
BE
Feb 5, 2024
This course provides a great overview and Roadmap for Heterogeneous Integration and Advanced packaging. A great starting point for anyone who wants to explore the world of HI.
1 - 14 of 14 Reviews for Advanced Semiconductor Packaging
By lucas n
•Sep 19, 2024
As a pioneer in the industry, Intel should share more detailed materials or case studies, especially considering the advancements and maturity of packaging, assembly, and testing since Moore's era.
By Basil E
•Feb 6, 2024
This course provides a great overview and Roadmap for Heterogeneous Integration and Advanced packaging. A great starting point for anyone who wants to explore the world of HI.
By Adokanou
•Jul 12, 2025
Complete course for IC Packaging topics
By 2023 1
•Mar 10, 2024
Good and Informative Course!
By Dinesh R
•Mar 22, 2025
Excellent Course!
By Sachin P
•Sep 21, 2024
very good
By Perez C J
•Nov 1, 2024
excelent
By 민건희
•May 15, 2024
Good.
By Swetha r G
•Sep 11, 2024
good
By Sonal
•Nov 21, 2024
-
By Ranganath K
•Mar 29, 2024
Very well deliverd and extremely pleased with the contents
By 01fe20bec164
•Oct 18, 2024
-
By Boyi F
•Nov 15, 2023
I hope this class can provide more detailed introduction of advanced packaging techniques, such CoWoS, EMIB, CPO....
By Gonçalo S
•Dec 6, 2024
Should be more detailed oriented. Target public seems to be marketing